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Inventor
WANG LOW PENG
SG
2 patents
⚠️ This page may combine multiple inventors who share the name “WANG LOW PENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
1 patent
US7906853B2
Mar 15, 2011
Package structure for multiple die stack
MICRON TECHNOLOGY INC
5 citations
53
WANG LOW PENG
1 patent
US8444044B2
May 21, 2013
Apparatus and methods for forming wire bonds
WANG LOW PENG
4 citations
48