Inventor
SHIN YU-GYUN
KR67 patents
⚠️ This page may combine multiple inventors who share the name “SHIN YU-GYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
43 patentsUS6107143AAug 22, 2000
Method for forming a trench isolation structure in an integrated circuit
SAMSUNG ELECTRONICS CO LTD287 citations99
US7521331B2Apr 21, 2009
High dielectric film and related method of manufacture
SAMSUNG ELECTRONICS CO LTD64 citations98
US6037237AMar 14, 2000
Trench isolation methods utilizing composite oxide films
SAMSUNG ELECTRONICS CO LTD74 citations96
US7351622B2Apr 1, 2008
Methods of forming semiconductor device
SAMSUNG ELECTRONICS CO LTD54 citations95
US7501674B2Mar 10, 2009
Semiconductor device having fin transistor and planar transistor and associated methods of manufacture
SAMSUNG ELECTRONICS CO LTD38 citations93
US7326608B2Feb 5, 2008
Fin field effect transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD16 citations93
US5885883AMar 23, 1999
Methods of forming trench-based isolation regions with reduced susceptibility to edge defects
SAMSUNG ELECTRONICS CO LTD40 citations93
US6121110ASep 19, 2000
Trench isolation method for semiconductor device
SAMSUNG ELECTRONICS CO LTD40 citations92
US6083808AJul 4, 2000
Method for forming a trench isolation in a semiconductor device
SAMSUNG ELECTRONICS CO LTD19 citations92
US5858858AJan 12, 1999
Annealing methods for forming isolation trenches
SAMSUNG ELECTRONICS CO LTD28 citations92
US7998851B2Aug 16, 2011
Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD11 citations84
US7972950B2Jul 5, 2011
Method of fabricating semiconductor device having dual gate
SAMSUNG ELECTRONICS CO LTD8 citations84
US7537980B2May 26, 2009
Method of manufacturing a stacked semiconductor device
SAMSUNG ELECTRONICS CO LTD14 citations84
US7507652B2Mar 24, 2009
Methods of forming a composite dielectric structure and methods of manufacturing a semiconductor device including a composite dielectric structure
SAMSUNG ELECTRONICS CO LTD10 citations84
US7442596B2Oct 28, 2008
Methods of manufacturing fin type field effect transistors
SAMSUNG ELECTRONICS CO LTD12 citations84
US7419918B2Sep 2, 2008
Methods of forming a thin-film structure, methods of manufacturing non-volatile semiconductor devices using the same, and resulting non-volatile semiconductor devices
SAMSUNG ELECTRONICS CO LTD13 citations84
US7390719B2Jun 24, 2008
Method of manufacturing a semiconductor device having a dual gate structure
SAMSUNG ELECTRONICS CO LTD10 citations84
US7053006B2May 30, 2006
Methods of fabricating oxide layers by plasma nitridation and oxidation
SAMSUNG ELECTRONICS CO LTD11 citations84
US7968442B2Jun 28, 2011
Fin field effect transistor and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD11 citations83
US7652340B2Jan 26, 2010
Fin field effect transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations74
US6258726B1Jul 10, 2001
Method of forming isolation film for semiconductor devices
SAMSUNG ELECTRONICS CO LTD13 citations74
US6093622AJul 25, 2000
Isolation method of semiconductor device using second pad oxide layer formed through chemical vapor deposition (CVD)
SAMSUNG ELECTRONICS CO LTD10 citations74
US9543300B2Jan 10, 2017
CMOS transistor, semiconductor device including the transistor, and semiconductor module including the device
SAMSUNG ELECTRONICS CO LTD2 citations73
US7315063B2Jan 1, 2008
CMOS transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD7 citations71
US9236313B2Jan 12, 2016
Method of fabricating semiconductor device having dual gate
SAMSUNG ELECTRONICS CO LTD1 citations63
US7560319B2Jul 14, 2009
Method for fabricating a semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations63
US7557388B2Jul 7, 2009
MOSFET formed on a strained silicon layer
SAMSUNG ELECTRONICS CO LTD2 citations63
US7459353B2Dec 2, 2008
Methods of laterally forming single crystalline thin film regions from seed layers
SAMSUNG ELECTRONICS CO LTD5 citations63
US7393700B2Jul 1, 2008
Low temperature methods of etching semiconductor substrates
SAMSUNG ELECTRONICS CO LTD4 citations63
US7364955B2Apr 29, 2008
Methods of manufacturing semiconductor devices having single crystalline silicon layers
SAMSUNG ELECTRONICS CO LTD4 citations63
US7364990B2Apr 29, 2008
Epitaxial crystal growth process in the manufacturing of a semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations63
US7608509B2Oct 27, 2009
Method of manufacturing a flash memory device having compensation members formed on edge portions of a tunnel oxide layer
SAMSUNG ELECTRONICS CO LTD6 citations62
US7531881B2May 12, 2009
Semiconductor devices having transistors with different gate structures and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US7494859B2Feb 24, 2009
Semiconductor device having metal gate patterns and related method of manufacture
SAMSUNG ELECTRONICS CO LTD4 citations62
US7141116B2Nov 28, 2006
Method for manufacturing a silicon structure
SAMSUNG ELECTRONICS CO LTD5 citations62
US7514744B2Apr 7, 2009
Semiconductor device including carrier accumulation layers
SAMSUNG ELECTRONICS CO LTD4 citations61
US7492006B2Feb 17, 2009
Semiconductor transistors having surface insulation layers and methods of fabricating such transistors
SAMSUNG ELECTRONICS CO LTD3 citations61
US7956464B2Jun 7, 2011
Sputtering target and semiconductor device manufactured using the same
SAMSUNG ELECTRONICS CO LTD5 citations60
US7176049B2Feb 13, 2007
Method of increasing a free carrier concentration in a semiconductor substrate
SAMSUNG ELECTRONICS CO LTD2 citations60
US8361860B2Jan 29, 2013
Method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations52
US7892958B2Feb 22, 2011
Methods of fabricating semiconductor devices having transistors with different gate structures
SAMSUNG ELECTRONICS CO LTD0 citations52
US7799648B2Sep 21, 2010
Method of forming a MOSFET on a strained silicon layer
SAMSUNG ELECTRONICS CO LTD0 citations52
US7553742B2Jun 30, 2009
Method(s) of forming a thin layer
SAMSUNG ELECTRONICS CO LTD0 citations52
SAMSUNG ELECTRONICS CO INC
1 patentNA HOON-JOO
1 patentLEE HYE-LAN
1 patentPARK TAI-SU
1 patentLEE BYUNG-HAK
1 patentKIM JIN-BUM
1 patentSON YONG-HOON
1 patentShowing the top 50 of 67 patents by PatentIndex Score.