P

Inventor

SHIN YU-GYUN

KR67 patents
⚠️ This page may combine multiple inventors who share the name “SHIN YU-GYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

43 patents
US6107143AAug 22, 2000

Method for forming a trench isolation structure in an integrated circuit

SAMSUNG ELECTRONICS CO LTD287 citations99
US7521331B2Apr 21, 2009

High dielectric film and related method of manufacture

SAMSUNG ELECTRONICS CO LTD64 citations98
US6037237AMar 14, 2000

Trench isolation methods utilizing composite oxide films

SAMSUNG ELECTRONICS CO LTD74 citations96
US7351622B2Apr 1, 2008

Methods of forming semiconductor device

SAMSUNG ELECTRONICS CO LTD54 citations95
US7501674B2Mar 10, 2009

Semiconductor device having fin transistor and planar transistor and associated methods of manufacture

SAMSUNG ELECTRONICS CO LTD38 citations93
US7326608B2Feb 5, 2008

Fin field effect transistor and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD16 citations93
US5885883AMar 23, 1999

Methods of forming trench-based isolation regions with reduced susceptibility to edge defects

SAMSUNG ELECTRONICS CO LTD40 citations93
US6121110ASep 19, 2000

Trench isolation method for semiconductor device

SAMSUNG ELECTRONICS CO LTD40 citations92
US6083808AJul 4, 2000

Method for forming a trench isolation in a semiconductor device

SAMSUNG ELECTRONICS CO LTD19 citations92
US5858858AJan 12, 1999

Annealing methods for forming isolation trenches

SAMSUNG ELECTRONICS CO LTD28 citations92
US7998851B2Aug 16, 2011

Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD11 citations84
US7972950B2Jul 5, 2011

Method of fabricating semiconductor device having dual gate

SAMSUNG ELECTRONICS CO LTD8 citations84
US7537980B2May 26, 2009

Method of manufacturing a stacked semiconductor device

SAMSUNG ELECTRONICS CO LTD14 citations84
US7507652B2Mar 24, 2009

Methods of forming a composite dielectric structure and methods of manufacturing a semiconductor device including a composite dielectric structure

SAMSUNG ELECTRONICS CO LTD10 citations84
US7442596B2Oct 28, 2008

Methods of manufacturing fin type field effect transistors

SAMSUNG ELECTRONICS CO LTD12 citations84
US7419918B2Sep 2, 2008

Methods of forming a thin-film structure, methods of manufacturing non-volatile semiconductor devices using the same, and resulting non-volatile semiconductor devices

SAMSUNG ELECTRONICS CO LTD13 citations84
US7390719B2Jun 24, 2008

Method of manufacturing a semiconductor device having a dual gate structure

SAMSUNG ELECTRONICS CO LTD10 citations84
US7053006B2May 30, 2006

Methods of fabricating oxide layers by plasma nitridation and oxidation

SAMSUNG ELECTRONICS CO LTD11 citations84
US7968442B2Jun 28, 2011

Fin field effect transistor and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD11 citations83
US7652340B2Jan 26, 2010

Fin field effect transistor and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD6 citations74
US6258726B1Jul 10, 2001

Method of forming isolation film for semiconductor devices

SAMSUNG ELECTRONICS CO LTD13 citations74
US6093622AJul 25, 2000

Isolation method of semiconductor device using second pad oxide layer formed through chemical vapor deposition (CVD)

SAMSUNG ELECTRONICS CO LTD10 citations74
US9543300B2Jan 10, 2017

CMOS transistor, semiconductor device including the transistor, and semiconductor module including the device

SAMSUNG ELECTRONICS CO LTD2 citations73
US7315063B2Jan 1, 2008

CMOS transistor and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD7 citations71
US9236313B2Jan 12, 2016

Method of fabricating semiconductor device having dual gate

SAMSUNG ELECTRONICS CO LTD1 citations63
US7560319B2Jul 14, 2009

Method for fabricating a semiconductor device

SAMSUNG ELECTRONICS CO LTD4 citations63
US7557388B2Jul 7, 2009

MOSFET formed on a strained silicon layer

SAMSUNG ELECTRONICS CO LTD2 citations63
US7459353B2Dec 2, 2008

Methods of laterally forming single crystalline thin film regions from seed layers

SAMSUNG ELECTRONICS CO LTD5 citations63
US7393700B2Jul 1, 2008

Low temperature methods of etching semiconductor substrates

SAMSUNG ELECTRONICS CO LTD4 citations63
US7364955B2Apr 29, 2008

Methods of manufacturing semiconductor devices having single crystalline silicon layers

SAMSUNG ELECTRONICS CO LTD4 citations63
US7364990B2Apr 29, 2008

Epitaxial crystal growth process in the manufacturing of a semiconductor device

SAMSUNG ELECTRONICS CO LTD2 citations63
US7608509B2Oct 27, 2009

Method of manufacturing a flash memory device having compensation members formed on edge portions of a tunnel oxide layer

SAMSUNG ELECTRONICS CO LTD6 citations62
US7531881B2May 12, 2009

Semiconductor devices having transistors with different gate structures and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations62
US7494859B2Feb 24, 2009

Semiconductor device having metal gate patterns and related method of manufacture

SAMSUNG ELECTRONICS CO LTD4 citations62
US7141116B2Nov 28, 2006

Method for manufacturing a silicon structure

SAMSUNG ELECTRONICS CO LTD5 citations62
US7514744B2Apr 7, 2009

Semiconductor device including carrier accumulation layers

SAMSUNG ELECTRONICS CO LTD4 citations61
US7492006B2Feb 17, 2009

Semiconductor transistors having surface insulation layers and methods of fabricating such transistors

SAMSUNG ELECTRONICS CO LTD3 citations61
US7956464B2Jun 7, 2011

Sputtering target and semiconductor device manufactured using the same

SAMSUNG ELECTRONICS CO LTD5 citations60
US7176049B2Feb 13, 2007

Method of increasing a free carrier concentration in a semiconductor substrate

SAMSUNG ELECTRONICS CO LTD2 citations60
US8361860B2Jan 29, 2013

Method of manufacturing semiconductor device

SAMSUNG ELECTRONICS CO LTD1 citations52
US7892958B2Feb 22, 2011

Methods of fabricating semiconductor devices having transistors with different gate structures

SAMSUNG ELECTRONICS CO LTD0 citations52
US7799648B2Sep 21, 2010

Method of forming a MOSFET on a strained silicon layer

SAMSUNG ELECTRONICS CO LTD0 citations52
US7553742B2Jun 30, 2009

Method(s) of forming a thin layer

SAMSUNG ELECTRONICS CO LTD0 citations52

SAMSUNG ELECTRONICS CO INC

1 patent

NA HOON-JOO

1 patent

LEE HYE-LAN

1 patent

PARK TAI-SU

1 patent

LEE BYUNG-HAK

1 patent

KIM JIN-BUM

1 patent

SON YONG-HOON

1 patent

Showing the top 50 of 67 patents by PatentIndex Score.