Inventor
HSU SHU-CHIA
TW14 patents
Patents
14 patentsUS12237288B2Feb 25, 2025
Semiconductor die package and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations85
US10790254B2Sep 29, 2020
Chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US10629545B2Apr 21, 2020
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11990443B2May 21, 2024
Semiconductor die package and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74
US11694939B2Jul 4, 2023
Semiconductor package, integrated optical communication system
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11764123B2Sep 19, 2023
Semiconductor package, integrated optical communication system
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10985125B2Apr 20, 2021
Chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12165990B2Dec 10, 2024
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11587886B2Feb 21, 2023
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12327781B2Jun 10, 2025
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12315786B2May 27, 2025
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10867951B2Dec 15, 2020
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US10872871B2Dec 22, 2020
Chip package structure with dummy bump and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10340242B2Jul 2, 2019
Semiconductor device and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48