Inventor
TRABUCCO ROBERT T
US9 patents
Patents
9 patentsUS5435482AJul 25, 1995
Integrated circuit having a coplanar solder ball contact array
LSI LOGIC CORP145 citations98
US5610442AMar 11, 1997
Semiconductor device package fabrication method and apparatus
LSI LOGIC CORP100 citations97
US5989937ANov 23, 1999
Method for compensating for bottom warpage of a BGA integrated circuit
LSI LOGIC CORP42 citations96
US5745986AMay 5, 1998
Method of planarizing an array of plastically deformable contacts on an integrated circuit package to compensate for surface warpage
LSI LOGIC CORP65 citations96
US5388327AFeb 14, 1995
Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
LSI LOGIC CORP85 citations95
US5381848AJan 17, 1995
Casting of raised bump contacts on a substrate
LSI LOGIC CORP76 citations95
US6088914AJul 18, 2000
Method for planarizing an array of solder balls
LSI LOGIC CORP30 citations92
US5899737AMay 4, 1999
Fluxless solder ball attachment process
LSI LOGIC CORP38 citations92
US5761048AJun 2, 1998
Conductive polymer ball attachment for grid array semiconductor packages
LSI LOGIC CORP31 citations92