Inventor

TEST HOWARD R

US13 patents

Patents

13 patents

US6616967B1Sep 9, 2003

Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process

TEXAS INSTRUMENTS INC272 citations98

US6268662B1Jul 31, 2001

Wire bonded flip-chip assembly of semiconductor devices

TEXAS INSTRUMENTS INC154 citations98

US6800555B2Oct 5, 2004

Wire bonding process for copper-metallized integrated circuits

TEXAS INSTRUMENTS INC185 citations97

US6068180AMay 30, 2000

System, apparatus, and method for connecting a semiconductor chip to a three-dimensional leadframe

TEXAS INSTRUMENTS INC23 citations92

US4874722AOct 17, 1989

Process of packaging a semiconductor device with reduced stress forces

TEXAS INSTRUMENTS INC47 citations90

US5544804AAug 13, 1996

Capillary designs and process for fine pitch ball bonding

TEXAS INSTRUMENTS INC51 citations85

US7535104B2May 19, 2009

Structure and method for bond pads of copper-metallized integrated circuits

TEXAS INSTRUMENTS INC7 citations73

US5979743ANov 9, 1999

Method for making an IC device using a single-headed bonder

TEXAS INSTRUMENTS INC15 citations73

US7413974B2Aug 19, 2008

Copper-metallized integrated circuits having electroless thick copper bond pads

TEXAS INSTRUMENTS INC5 citations62

US7265443B2Sep 4, 2007

Wire bonded semiconductor device having low inductance and noise

TEXAS INSTRUMENTS INC2 citations62

US7217656B2May 15, 2007

Structure and method for bond pads of copper-metallized integrated circuits

TEXAS INSTRUMENTS INC3 citations62

US6869875B2Mar 22, 2005

Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process

TEXAS INSTRUMENTS INC1 citations51

US6619538B1Sep 16, 2003

Nickel plating process having controlled hydrogen concentration

TEXAS INSTRUMENTS INC0 citations51