Inventor
TAKAI EIJI
JP6 patents
⚠️ This page may combine multiple inventors who share the name “TAKAI EIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
5 patentsUS6805915B2Oct 19, 2004
Electroless copper plating solution, electroless copper plating process and production process of circuit board
HITACHI LTD15 citations92
US6831009B2Dec 14, 2004
Wiring substrate and an electroless copper plating solution for providing interlayer connections
HITACHI LTD7 citations73
US7169216B2Jan 30, 2007
Electroless copper plating solution, electroless copper plating process and production process of circuit board
HITACHI LTD4 citations62
US6989329B2Jan 24, 2006
Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections
HITACHI LTD3 citations62
US6900394B1May 31, 2005
Electroless copper plating machine, and multi-layer printed wiring board
HITACHI LTD5 citations62