Inventor

SUKAMTO JOHN H

US4 patents

⚠️ This page may combine multiple inventors who share the name “SUKAMTO JOHN H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PONNUSWAMY THOMAS A

2 patents

US8513124B1Aug 20, 2013

Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers

PONNUSWAMY THOMAS A30 citations91

US8703615B1Apr 22, 2014

Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers

PONNUSWAMY THOMAS A21 citations89

NOVELLUS SYSTEMS INC

2 patents

US7232513B1Jun 19, 2007

Electroplating bath containing wetting agent for defect reduction

NOVELLUS SYSTEMS INC51 citations91

US6884335B2Apr 26, 2005

Electroplating using DC current interruption and variable rotation rate

NOVELLUS SYSTEMS INC23 citations90