Inventor
NISHINAKA TERUAKI
JP15 patents
⚠️ This page may combine multiple inventors who share the name “NISHINAKA TERUAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
7 patentsUS5655704AAug 12, 1997
Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD91 citations96
US5695667ADec 9, 1997
Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD62 citations93
US7107672B2Sep 19, 2006
Method of mounting electronic parts on a flexible printed circuit board
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD22 citations92
US5894984AApr 20, 1999
Structure of electronic parts and method of soldering electronic parts to substrate
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD31 citations92
US6013899AJan 11, 2000
Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD24 citations90
US5779958AJul 14, 1998
Method for packaging electronic device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD27 citations87
US5548891AAug 27, 1996
Method of automatically mounting electronic connector onto an end of printed circuit board
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD5 citations62
PANASONIC CORP
4 patentsUS7629228B2Dec 8, 2009
Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks
PANASONIC CORP155 citations99
US7488668B2Feb 10, 2009
Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions
PANASONIC CORP40 citations92
US7797822B2Sep 21, 2010
Electronic component mounting method
PANASONIC CORP10 citations84
US7989803B2Aug 2, 2011
Manufacturing method for semiconductor chips and semiconductor wafer
PANASONIC CORP2 citations62
PANASONIC IP MAN CO LTD
3 patentsUS9332681B2May 3, 2016
Electronic component mounting system
PANASONIC IP MAN CO LTD5 citations72
US12247827B2Mar 11, 2025
Bead appearance inspection device, bead appearance inspection method, program, and bead appearance inspection system
PANASONIC IP MAN CO LTD0 citations48
US9439336B2Sep 6, 2016
Component mounting system
PANASONIC IP MAN CO LTD0 citations33