Inventor

KIANG BILL

TW6 patents

⚠️ This page may combine multiple inventors who share the name “KIANG BILL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

3 patents

US7719122B2May 18, 2010

System-in-package packaging for minimizing bond wire contamination and yield loss

TAIWAN SEMICONDUCTOR MFG72 citations96

US9136211B2Sep 15, 2015

Protected solder ball joints in wafer level chip-scale packaging

TAIWAN SEMICONDUCTOR MFG5 citations73

US7679180B2Mar 16, 2010

Bond pad design to minimize dielectric cracking

TAIWAN SEMICONDUCTOR MFG6 citations61

TAIWAN SEMINCONDUCTOR MFG CO L

1 patent

US7659632B2Feb 9, 2010

Solder bump structure and method of manufacturing same

TAIWAN SEMINCONDUCTOR MFG CO L30 citations90

WANG CHUNG YU

1 patent

US8492263B2Jul 23, 2013

Protected solder ball joints in wafer level chip-scale packaging

WANG CHUNG YU11 citations83

TSAO PEI-HAW

1 patent

US8217520B2Jul 10, 2012

System-in-package packaging for minimizing bond wire contamination and yield loss

TSAO PEI-HAW0 citations45