Inventor
NIU PAO-KANG
TW11 patents
⚠️ This page may combine multiple inventors who share the name “NIU PAO-KANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
6 patentsUS7719122B2May 18, 2010
System-in-package packaging for minimizing bond wire contamination and yield loss
TAIWAN SEMICONDUCTOR MFG72 citations96
US7602065B2Oct 13, 2009
Seal ring in semiconductor device
TAIWAN SEMICONDUCTOR MFG18 citations92
US7148574B2Dec 12, 2006
Bonding pad structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG30 citations91
US7446398B2Nov 4, 2008
Bump pattern design for flip chip semiconductor package
TAIWAN SEMICONDUCTOR MFG15 citations82
US7843058B2Nov 30, 2010
Flip chip packages with spacers separating heat sinks and substrates
TAIWAN SEMICONDUCTOR MFG6 citations73
US7679180B2Mar 16, 2010
Bond pad design to minimize dielectric cracking
TAIWAN SEMICONDUCTOR MFG6 citations61
WORLDWIDE SEMICONDUCTOR MFG
3 patentsUS6410441B1Jun 25, 2002
Auto slurry deliver fine-tune system for chemical-mechanical-polishing process and method of using the system
WORLDWIDE SEMICONDUCTOR MFG5 citations72
US6277751B1Aug 21, 2001
Method of planarization
WORLDWIDE SEMICONDUCTOR MFG9 citations72
US6630051B2Oct 7, 2003
Auto slurry deliver fine-tune systems for chemical-mechanical-polishing process and method of using the system
WORLDWIDE SEMICONDUCTOR MFG3 citations61