Inventor
GURRUM SIVA P
US9 patents
⚠️ This page may combine multiple inventors who share the name “GURRUM SIVA P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
8 patentsUS9165873B1Oct 20, 2015
Semiconductor package having etched foil capacitor integrated into leadframe
TEXAS INSTRUMENTS INC10 citations83
US7989949B2Aug 2, 2011
Heat extraction from packaged semiconductor chips, scalable with chip area
TEXAS INSTRUMENTS INC9 citations83
US7572679B2Aug 11, 2009
Heat extraction from packaged semiconductor chips, scalable with chip area
TEXAS INSTRUMENTS INC7 citations73
US9373572B2Jun 21, 2016
Semiconductor package having etched foil capacitor integrated into leadframe
TEXAS INSTRUMENTS INC2 citations61
US8716068B2May 6, 2014
Method for contacting agglomerate terminals of semiconductor packages
TEXAS INSTRUMENTS INC2 citations61
US11430719B2Aug 30, 2022
Spot-solderable leads for semiconductor device packages
TEXAS INSTRUMENTS INC0 citations54
US10607927B2Mar 31, 2020
Spot-solderable leads for semiconductor device packages
TEXAS INSTRUMENTS INC0 citations47
US9142496B1Sep 22, 2015
Semiconductor package having etched foil capacitor integrated into leadframe
TEXAS INSTRUMENTS INC0 citations40