Inventor
PHARAND SYLVAIN
CA10 patents
⚠️ This page may combine multiple inventors who share the name “PHARAND SYLVAIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS11209598B2Dec 28, 2021
Photonics package with face-to-face bonding
IBM11 citations82
US9793232B1Oct 17, 2017
All intermetallic compound with stand off feature and method to make
IBM2 citations72
US11310921B2Apr 19, 2022
Buried via in a circuit board
IBM2 citations70
US9111793B2Aug 18, 2015
Joining a chip to a substrate with solder alloys having different reflow temperatures
IBM2 citations60
US7482180B1Jan 27, 2009
Method for determining the impact of layer thicknesses on laminate warpage
IBM3 citations60
US12504747B2Dec 23, 2025
Multicomponent module design and fabrication
IBM0 citations56
US11004614B2May 11, 2021
Stacked capacitors for use in integrated circuit modules and the like
IBM0 citations51
US11404365B2Aug 2, 2022
Direct attachment of capacitors to flip chip dies
IBM0 citations50