Inventor
CHIANG CHUNG-SUNG
TW4 patents
Patents
4 patentsUS8916471B1Dec 23, 2014
Method for forming semiconductor structure having through silicon via for signal and shielding structure
UNITED MICROELECTRONICS CORP35 citations92
US12243839B2Mar 4, 2025
Bonded semiconductor structure utilizing concave/convex profile design for bonding pads
UNITED MICROELECTRONICS CORP0 citations61
US11935854B2Mar 19, 2024
Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding pads
UNITED MICROELECTRONICS CORP0 citations61
US11640949B2May 2, 2023
Bonded semiconductor structure utilizing concave/convex profile design for bonding pads
UNITED MICROELECTRONICS CORP0 citations61