Inventor
OH TAE S
US6 patents
⚠️ This page may combine multiple inventors who share the name “OH TAE S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
3 patentsUS5582858ADec 10, 1996
Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
IBM113 citations98
US5326643AJul 5, 1994
Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
IBM41 citations96
US5599582AFeb 4, 1997
Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
IBM25 citations92