Inventor
CHUNG JAE YUP
KR25 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG JAE YUP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
21 patentsUS9117910B2Aug 25, 2015
Semiconductor device and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD23 citations91
US9947656B2Apr 17, 2018
Integrated circuit devices including fin active areas with different shapes
SAMSUNG ELECTRONICS CO LTD9 citations84
US9299811B2Mar 29, 2016
Methods of fabricating semiconductor devices
SAMSUNG ELECTRONICS CO LTD7 citations83
US10032886B2Jul 24, 2018
Semiconductor device
SAMSUNG ELECTRONICS CO LTD8 citations82
US9735059B2Aug 15, 2017
Method of fabricating semiconductor device including an etch barrier pattern
SAMSUNG ELECTRONICS CO LTD4 citations82
US10522545B2Dec 31, 2019
Integrated circuit device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US10157921B2Dec 18, 2018
Integrated circuit devices including FIN active areas with different shapes
SAMSUNG ELECTRONICS CO LTD5 citations73
US10205023B2Feb 12, 2019
Semiconductor device including multi-channel active patterns
SAMSUNG ELECTRONICS CO LTD2 citations72
US10096714B2Oct 9, 2018
Integrated circuit device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations72
US10074572B2Sep 11, 2018
Integrated circuit devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US9755074B2Sep 5, 2017
Semiconductor device including a multi-channel active pattern
SAMSUNG ELECTRONICS CO LTD3 citations72
US10128154B2Nov 13, 2018
Semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations71
US10943904B2Mar 9, 2021
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations61
US10535666B2Jan 14, 2020
Integrated circuit devices including fin shapes
SAMSUNG ELECTRONICS CO LTD0 citations52
US10854608B2Dec 1, 2020
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations51
US10685960B2Jun 16, 2020
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations51
US10483399B2Nov 19, 2019
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations51
US10840142B2Nov 17, 2020
Semiconductor device including a three-dimensional channel
SAMSUNG ELECTRONICS CO LTD0 citations50
US10672890B2Jun 2, 2020
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations40
US10804264B2Oct 13, 2020
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations38
US10763156B2Sep 1, 2020
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations38
CHUNG JAE YUP
3 patentsUS9899393B2Feb 20, 2018
Integrated circuit devices including fin shapes
CHUNG JAE YUP6 citations83
US9893064B2Feb 13, 2018
Integrated circuit device and method of manufacturing the same
CHUNG JAE YUP14 citations83
US9922979B2Mar 20, 2018
Integrated circuit device and method of manufacturing the same
CHUNG JAE YUP12 citations81