Inventor

LANG TEEMU

FI8 patents

⚠️ This page may combine multiple inventors who share the name “LANG TEEMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PLANAR SYSTEMS INC

6 patents

US7021330B2Apr 4, 2006

Diaphragm valve with reliability enhancements for atomic layer deposition

PLANAR SYSTEMS INC384 citations97

US6941963B2Sep 13, 2005

High-speed diaphragm valve for atomic layer deposition

PLANAR SYSTEMS INC31 citations90

US6907897B2Jun 21, 2005

Diaphragm valve for high-temperature precursor supply in atomic layer deposition

PLANAR SYSTEMS INC30 citations90

US7141095B2Nov 28, 2006

INTEL CORP

2 patents

US7030430B2Apr 18, 2006

Transition metal alloys for use as a gate electrode and devices incorporating these alloys

INTEL CORP81 citations96

US7193253B2Mar 20, 2007

Transition metal alloys for use as a gate electrode and devices incorporating these alloys

INTEL CORP9 citations72

LANG TEEMU

PLANAR SYSTEMS INC

Diaphragm valve with reliability enhancements for atomic layer deposition

High-speed diaphragm valve for atomic layer deposition

Diaphragm valve for high-temperature precursor supply in atomic layer deposition

Precursor material delivery system for atomic layer deposition

Deposition of carbon- and transition metal-containing thin films

Diaphragm valve for atomic layer deposition

INTEL CORP

Transition metal alloys for use as a gate electrode and devices incorporating these alloys

Transition metal alloys for use as a gate electrode and devices incorporating these alloys