Inventor
SUNG MING-CHUNG
TW13 patents
⚠️ This page may combine multiple inventors who share the name “SUNG MING-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
5 patentsUS7265034B2Sep 4, 2007
Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade
TAIWAN SEMICONDUCTOR MFG33 citations92
US7951647B2May 31, 2011
Performing die-to-wafer stacking by filling gaps between dies
TAIWAN SEMICONDUCTOR MFG9 citations84
US9165876B2Oct 20, 2015
Package-on-package structure and methods for forming the same
TAIWAN SEMICONDUCTOR MFG3 citations63
US7642631B2Jan 5, 2010
Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer
TAIWAN SEMICONDUCTOR MFG4 citations63
US7977155B2Jul 12, 2011
Wafer-level flip-chip assembly methods
TAIWAN SEMICONDUCTOR MFG1 citations51
SUNG MING-CHUNG
3 patentsUS8652939B2Feb 18, 2014
Method and apparatus for die assembly
SUNG MING-CHUNG6 citations71
US8796132B2Aug 5, 2014
System and method for forming uniform rigid interconnect structures
SUNG MING-CHUNG2 citations60
US8664039B2Mar 4, 2014
Methods and apparatus for alignment in flip chip bonding
SUNG MING-CHUNG1 citations50