Inventor
LEE SHENG TA
TW30 patents
⚠️ This page may combine multiple inventors who share the name “LEE SHENG TA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PIXART IMAGING INC
8 patentsUS8371167B2Feb 12, 2013
In-plane sensor, out-of-plane sensor, and method for making same
PIXART IMAGING INC4 citations62
US8372675B2Feb 12, 2013
Microelectronic device and fabricating method thereof and MEMS package structure and fabricating method thereof
PIXART IMAGING INC2 citations62
US7989247B2Aug 2, 2011
In-plane sensor and method for making same
PIXART IMAGING INC3 citations62
US9000544B2Apr 7, 2015
MEMS package structure
PIXART IMAGING INC0 citations52
US8692338B2Apr 8, 2014
Micro electronic device having CMOS circuit and MEMS resonator formed on common silicon substrate
PIXART IMAGING INC1 citations52
US8679886B2Mar 25, 2014
Microelectronic device and MEMS package structure and fabricating method thereof
PIXART IMAGING INC0 citations52
US8372563B2Feb 12, 2013
MEMS lithography mask with improved tungsten deposition topography and method for the same
PIXART IMAGING INC0 citations52
US8371168B2Feb 12, 2013
In-plane sensor and method for making same
PIXART IMAGING INC0 citations52
WANG CHUAN-WEI
5 patentsUS8183650B2May 22, 2012
MEMS device and MEMS spring element
WANG CHUAN-WEI6 citations72
US8952463B2Feb 10, 2015
MEMS structure preventing stiction
WANG CHUAN-WEI2 citations62
US8329492B2Dec 11, 2012
Micro electronic device and method for fabricating micro electromechanical system resonator thereof
WANG CHUAN-WEI2 citations62
US8513041B2Aug 20, 2013
MEMS integrated chip and method for making same
WANG CHUAN-WEI1 citations52
US8424383B2Apr 23, 2013
Mass for use in a micro-electro-mechanical-system sensor and 3-dimensional micro-electro-mechanical-system sensor using same
WANG CHUAN-WEI1 citations52
HSU HSIN-HUI
4 patentsUS8829628B2Sep 9, 2014
MEMS package structure
HSU HSIN-HUI2 citations61
US8729660B2May 20, 2014
MEMS integrated chip with cross-area interconnection
HSU HSIN-HUI0 citations51
US8704331B2Apr 22, 2014
MEMS integrated chip with cross-area interconnection
HSU HSIN-HUI0 citations51
US8247253B2Aug 21, 2012
MEMS package structure and method for fabricating the same
HSU HSIN-HUI0 citations51
WANG CHUAN WEI
4 patentsUS8664099B2Mar 4, 2014
Micro-electro-mechanical-system device with particles blocking function and method for making same
WANG CHUAN WEI0 citations52
US8529773B2Sep 10, 2013
Method for making micro-electro-mechanical system device
WANG CHUAN WEI0 citations52
US8303827B2Nov 6, 2012
Method for making micro-electro-mechanical system device
WANG CHUAN WEI0 citations52
US8117919B2Feb 21, 2012
Micro-electro-mechanical system device
WANG CHUAN WEI1 citations52
LEE SHENG TA
3 patentsUS8426934B2Apr 23, 2013
Micro-electro-mechanical system device and method for making same
LEE SHENG TA3 citations61
US8640543B2Feb 4, 2014
Micro-electro-mechanical system device, out-of-plane sensor and method for making micro-electro-mechanical system device
LEE SHENG TA1 citations50
US8183076B2May 22, 2012
Micro-electro-mechanical system device, out-of-plane sensor and method for making micro-electro-mechanical system device
LEE SHENG TA1 citations50