Inventor
FARRENS SHARON N
US14 patents
⚠️ This page may combine multiple inventors who share the name “FARRENS SHARON N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLO AB
7 patentsUS10193038B2Jan 29, 2019
Through backplane laser irradiation for die transfer
GLO AB22 citations93
US9893041B2Feb 13, 2018
Method of forming an array of a multi-device unit cell
GLO AB29 citations93
US10177123B2Jan 8, 2019
Light emitting diode array on a backplane and method of making thereof
GLO AB30 citations92
US10714464B2Jul 14, 2020
Method of selectively transferring LED die to a backplane using height controlled bonding structures
GLO AB11 citations85
US10236447B2Mar 19, 2019
Selective die repair on a light emitting device assembly
GLO AB10 citations84
US10693051B2Jun 23, 2020
Through backplane laser irradiation for die transfer
GLO AB2 citations72
US10553571B2Feb 4, 2020
Method of forming an array of a multi-device unit cell
GLO AB0 citations51
SILICON GENESIS CORP
4 patentsUS6908832B2Jun 21, 2005
In situ plasma wafer bonding method
SILICON GENESIS CORP134 citations98
US6534381B2Mar 18, 2003
Method for fabricating multi-layered substrates
SILICON GENESIS CORP139 citations98
US6180496B1Jan 30, 2001
In situ plasma wafer bonding method
SILICON GENESIS CORP249 citations98
US6645828B1Nov 11, 2003
In situ plasma wafer bonding method
SILICON GENESIS CORP98 citations97
MICRON TECHNOLOGY INC
3 patentsUS9472518B2Oct 18, 2016
Semiconductor structures including carrier wafers and methods of using such semiconductor structures
MICRON TECHNOLOGY INC4 citations72
US9716023B2Jul 25, 2017
Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies
MICRON TECHNOLOGY INC4 citations70
US10128142B2Nov 13, 2018
Semiconductor structures including carrier wafers and attached device wafers, and methods of forming such semiconductor structures
MICRON TECHNOLOGY INC0 citations51