Inventor

TUNG LIN-CHOU

TW3 patents

Patents

3 patents

US6569712B2May 27, 2003

Structure of a ball-grid array package substrate and processes for producing thereof

VIA TECH INC45 citations90

US6699046B2Mar 2, 2004

Pin grid array integrated circuit connecting device

VIA TECH INC13 citations80

US6724081B2Apr 20, 2004

Electronic assembly

VIA TECH INC6 citations59