P

Inventor

OHIWA TOKUHISA

JP33 patents
⚠️ This page may combine multiple inventors who share the name “OHIWA TOKUHISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOSHIBA KK

25 patents
US6433297B1Aug 13, 2002

Plasma processing method and plasma processing apparatus

TOSHIBA KK90 citations98
US5756402AMay 26, 1998

Method of etching silicon nitride film

TOSHIBA KK250 citations97
US5998100ADec 7, 1999

Fabrication process using a multi-layer antireflective layer

TOSHIBA KK89 citations96
US5759746AJun 2, 1998

Fabrication process using a thin resist

TOSHIBA KK75 citations96
US5310454AMay 10, 1994

Dry etching method

TOSHIBA KK54 citations96
US5094879AMar 10, 1992

Method of activating at least one gas to produce different charged species, selecting specific species, decelerating the species, and chemically reacting the species to form a thin film

TOSHIBA KK24 citations93
US6576562B2Jun 10, 2003

Manufacturing method of semiconductor device using mask pattern having high etching resistance

TOSHIBA KK36 citations92
US5874363AFeb 23, 1999

Polycide etching with HCL and chlorine

TOSHIBA KK35 citations88
US7022616B2Apr 4, 2006

High speed silicon etching method

TOSHIBA KK15 citations84
US6780278B2Aug 24, 2004

Plasma processing apparatus with reduced parasitic capacity and loss in RF power

TOSHIBA KK16 citations84
US6911398B2Jun 28, 2005

Method of sequentially processing a plurality of lots each including semiconductor substrates

TOSHIBA KK10 citations74
US6689699B2Feb 10, 2004

Method for manufacturing a semiconductor device using recirculation of a process gas

TOSHIBA KK8 citations74
US6274512B1Aug 14, 2001

Method for manufacturing a semiconductor device

TOSHIBA KK11 citations74
US5658389AAug 19, 1997

Thin film forming method and apparatus

TOSHIBA KK9 citations74
US6846750B1Jan 25, 2005

High precision pattern forming method of manufacturing a semiconductor device

TOSHIBA KK9 citations73
US6420271B2Jul 16, 2002

Method of forming a pattern

TOSHIBA KK8 citations73
US6369423B2Apr 9, 2002

Semiconductor device with a thin gate stack having a plurality of insulating layers

TOSHIBA KK9 citations73
US6887802B2May 3, 2005

Method of manufacturing semiconductor device and semiconductor device

TOSHIBA KK3 citations63
US7327455B2Feb 5, 2008

Process monitoring system, process monitoring method, and method for manufacturing semiconductor device

TOSHIBA KK2 citations60
US7285498B2Oct 23, 2007

Etching method

TOSHIBA KK2 citations60
US7045462B2May 16, 2006

Method for fabricating a pattern and method for manufacturing a semiconductor device

TOSHIBA KK5 citations60
US7767582B2Aug 3, 2010

Method of manufacturing semiconductor device

TOSHIBA KK1 citations51
US7595885B2Sep 29, 2009

Process monitoring system, process monitoring method, and method for manufacturing semiconductor device

TOSHIBA KK0 citations50
US7349088B2Mar 25, 2008

Process monitoring system, process monitoring method, and method for manufacturing semiconductor device

TOSHIBA KK0 citations50
US7182879B2Feb 27, 2007

Plasma processing method

TOSHIBA KK0 citations42

TOKYO ELECTRON LTD

2 patents

TAHARA SHIGERU

2 patents

EBARA CORP

1 patent

SASAKI TOSHIYUKI

1 patent

OMURA MITSUHIRO

1 patent

SAKURAI NORIKO

1 patent