Inventor
LIN CHIU-SHUN
TW6 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHIU-SHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HIMAX TECH LTD
3 patentsUS9450061B2Sep 20, 2016
Metal bump structure for use in driver IC and method for forming the same
HIMAX TECH LTD8 citations80
US7906374B2Mar 15, 2011
COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling a driver IC and the COF packaging structure thereof
HIMAX TECH LTD3 citations60
US10128348B2Nov 13, 2018
Metal bump structure for use in driver IC and method for forming the same
HIMAX TECH LTD1 citations48