Inventor
KALIDAS NAVINCHANDRA
US11 patents
Patents
11 patentsUS6084777AJul 4, 2000
Ball grid array package
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US5895967AApr 20, 1999
Ball grid array package having a deformable metal layer and method
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US6396136B2May 28, 2002
Ball grid package with multiple power/ground planes
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US5777382AJul 7, 1998
Plastic packaging for a surface mounted integrated circuit
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US4540226ASep 10, 1985
Intelligent electronic connection socket
TEXAS INSTRUMENTS INC47 citations89
US6794743B1Sep 21, 2004
Structure and method of high performance two layer ball grid array substrate
TEXAS INSTRUMENTS INC10 citations73
US6995037B2Feb 7, 2006
Structure and method of high performance two layer ball grid array substrate
TEXAS INSTRUMENTS INC2 citations62
US7135781B2Nov 14, 2006
Low profile, chip-scale package and method of fabrication
TEXAS INSTRUMENTS INC4 citations58
US7795072B2Sep 14, 2010
Structure and method of high performance two layer ball grid array substrate
TEXAS INSTRUMENTS INC0 citations51
US7309648B2Dec 18, 2007
Low profile, chip-scale package and method of fabrication
TEXAS INSTRUMENTS INC1 citations48
US5976914ANov 2, 1999
Method of making plastic package for a surface mounted integrated circuit
TEXAS INSTRUMENTS INC1 citations48