Inventor
WOMBACHER RALF
DE14 patents
⚠️ This page may combine multiple inventors who share the name “WOMBACHER RALF”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
10 patentsUS7847375B2Dec 7, 2010
Electronic device and method of manufacturing same
INFINEON TECHNOLOGIES AG10 citations84
US7705472B2Apr 27, 2010
Semiconductor device with semiconductor device components embedded in a plastic housing composition
INFINEON TECHNOLOGIES AG14 citations81
US10056348B2Aug 21, 2018
Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate
INFINEON TECHNOLOGIES AG2 citations73
US9379033B2Jun 28, 2016
Sensor package
INFINEON TECHNOLOGIES AG4 citations72
US9159701B2Oct 13, 2015
Method of manufacturing a chip package, chip package, method of manufacturing a chip assembly and chip assembly
INFINEON TECHNOLOGIES AG4 citations70
US12218098B2Feb 4, 2025
Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate
INFINEON TECHNOLOGIES AG0 citations62
US11309277B2Apr 19, 2022
Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate
INFINEON TECHNOLOGIES AG0 citations62
US7645636B2Jan 12, 2010
Semiconductor device and method for producing it, and use of an electrospinning method
INFINEON TECHNOLOGIES AG2 citations61
US10734351B2Aug 4, 2020
Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate
INFINEON TECHNOLOGIES AG0 citations52
US9530754B2Dec 27, 2016
Chip package and chip assembly
INFINEON TECHNOLOGIES AG0 citations49