P

Inventor

KANG HOYOUNG

US23 patents
⚠️ This page may combine multiple inventors who share the name “KANG HOYOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOKYO ELECTRON LTD

19 patents
US10068764B2Sep 4, 2018

Selective metal oxide deposition using a self-assembled monolayer surface pretreatment

TOKYO ELECTRON LTD7 citations84
US9385129B2Jul 5, 2016

Method of forming a memory capacitor structure using a self-assembly pattern

TOKYO ELECTRON LTD12 citations83
US10115726B2Oct 30, 2018

Method and system for forming memory fin patterns

TOKYO ELECTRON LTD4 citations72
US11791167B2Oct 17, 2023

Cyclic self-limiting etch process

TOKYO ELECTRON LTD2 citations71
US11460775B2Oct 4, 2022

Method and system for prevention of metal contamination by using a self-assembled monolayer coating

TOKYO ELECTRON LTD2 citations71
US12341053B2Jun 24, 2025

System for backside deposition of a substrate

TOKYO ELECTRON LTD0 citations62
US11908728B2Feb 20, 2024

System for backside deposition of a substrate

TOKYO ELECTRON LTD0 citations62
US11484993B2Nov 1, 2022

Substrate holding apparatus and method for shape metrology

TOKYO ELECTRON LTD0 citations62
US11247309B2Feb 15, 2022

Substrate holding apparatus and method for shape metrology

TOKYO ELECTRON LTD0 citations62
US11314166B2Apr 26, 2022

Fast imprint lithography

TOKYO ELECTRON LTD0 citations61
US10890843B2Jan 12, 2021

Fast imprint lithography

TOKYO ELECTRON LTD0 citations61
US11043378B2Jun 22, 2021

Systems and methods for inhibiting detectivity, metal particle contamination, and film growth on wafers

TOKYO ELECTRON LTD0 citations60
US12354991B2Jul 8, 2025

Replacement buried power rail in backside power delivery

TOKYO ELECTRON LTD0 citations52
US11567407B2Jan 31, 2023

Method for globally adjusting spacer critical dimension using photo-active self-assembled monolayer

TOKYO ELECTRON LTD0 citations52
US10784100B2Sep 22, 2020

Back-side friction reduction of a substrate

TOKYO ELECTRON LTD0 citations51
US9508557B2Nov 29, 2016

Method of improving line roughness in substrate processing

TOKYO ELECTRON LTD1 citations51
US10525416B2Jan 7, 2020

Method of liquid filter wetting

TOKYO ELECTRON LTD0 citations50
US10707070B2Jul 7, 2020

Methods and systems for coating a substrate with a fluid

TOKYO ELECTRON LTD0 citations40
US10504715B2Dec 10, 2019

Back-side friction reduction of a substrate

TOKYO ELECTRON LTD0 citations40

SAMSUNG SDS CO LTD

1 patent

LS ELECTRIC CO LTD

1 patent

CYPRESS SEMICONDUCTOR CORP

1 patent

KANG HOYOUNG

1 patent