Inventor
Chen bo hua
TW4 patents
⚠️ This page may combine multiple inventors who share the name “Chen bo hua”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
3 patentsUS11587809B2Feb 21, 2023
Wafer supporting mechanism and method for wafer dicing
ADVANCED SEMICONDUCTOR ENG2 citations68
US12112965B2Oct 8, 2024
Wafer supporting mechanism and method for wafer dicing
ADVANCED SEMICONDUCTOR ENG0 citations58
US11189518B2Nov 30, 2021
Method of processing a semiconductor wafer
ADVANCED SEMICONDUCTOR ENG0 citations42