Inventor
WU KAI-DI
TW15 patents
⚠️ This page may combine multiple inventors who share the name “WU KAI-DI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
14 patentsUS11955484B2Apr 9, 2024
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11404413B2Aug 2, 2022
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11177228B2Nov 16, 2021
Semiconductor device and bump formation process
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US10163849B2Dec 25, 2018
Method of manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12559362B2Feb 24, 2026
Micro-electro mechanical system and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11851321B2Dec 26, 2023
Micro-electro mechanical system and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12563826B2Feb 24, 2026
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11908818B2Feb 20, 2024
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11594508B2Feb 28, 2023
Redistribution lines having nano columns and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11069652B2Jul 20, 2021
Method of manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12463169B2Nov 4, 2025
Redistribution lines having nano columns and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10535629B2Jan 14, 2020
Method of manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10319695B2Jun 11, 2019
Semiconductor device and bump formation process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9799625B2Oct 24, 2017
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50