Inventor
NG VEMMOND JENG HUNG
MY9 patents
Patents
9 patentsUS11830856B2Nov 28, 2023
Semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC8 citations83
US12300558B2May 13, 2025
Substrates and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11482468B2Oct 25, 2022
Power module package casing with protrusion supports
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12402264B2Aug 26, 2025
Stacked power terminals in a power electronics module
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12283562B2Apr 22, 2025
Clip design and method of controlling clip position
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12347813B2Jul 1, 2025
Semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12131981B2Oct 29, 2024
Power module package baseplate with step recess design
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US11735504B2Aug 22, 2023
Power module package baseplate with step recess design
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12513870B2Dec 30, 2025
Power module
SEMICONDUCTOR COMPONENTS IND LLC0 citations46