Inventor

DEDE ERCAN MEHMET

US160 patents

⚠️ This page may combine multiple inventors who share the name “DEDE ERCAN MEHMET”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DEDE ERCAN MEHMET

TOYOTA ENG & MFG NORTH AMERICA

Configurable double-sided modular jet impingement assemblies for electronics cooling

Acoustic absorber with integrated heat sink

Seat blocking system and method

Asymmetric configurable double-sided manifold micro-channel cold plates

Fan performance tuning

Thermal management solution for battery pack

Self-assembled or reconfigurable structures for heat flow control devices

Cooling loops and vehicles incorporating the same

Cooling apparatuses, electronic device assemblies, and cooling assemblies using magnetic shape memory members

Systems and methods for providing heating and cooling to a vehicle cabin of autonomous vehicles

Method of etching microelectronic mechanical system features in a silicon wafer

Jet impingement coolers and power electronics modules comprising the same

Vehicles, power electronics modules and cooling apparatuses with single-phase and two-phase surface enhancement features

Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features

Extendable biosensing devices and vehicles incorporating the same

Cooling apparatuses having sloped vapor outlet channels

Reconfigurable soft robotics-based vehicle interior for infant boarding

Double-sided cooling cold plates with overhanging heat sinks and through body busbar for high-power density power electronics

Transparent display systems and methods

Fuel cell bipolar plates with flow uniformity

Cooling system for vehicle motor drive

Power electronics modules including integrated jet cooling

Cooling systems comprising fluid diodes with variable diodicity for two-phase flow control

Cooling system for vehicle motor drive

Multi-layer wick structures with surface enhancement and fabrication methods

Methods for orienting material physical properties using constraint transformation and isoparametric shape functions

Hybrid bonding materials comprising ball grid arrays and metal inverse opal bonding layers, and power electronics assemblies incorporating the same

Cooling bond layer and power electronics assemblies incorporating the same

Power electronics assemblies with metal inverse opal bonding, electrical contact and cooling layers, and vehicles incorporating the same

Hybrid vehicle with in wheel motor and rankine cycle system

Electric vehicle and fuel cell vehicle with rankine cycle

DEDE ERCAN MEHMET

Cooling apparatuses and power electronics modules

Power electronics modules and power electronics module assemblies

Power electronics card assemblies, power electronics modules, and power electronics devices

Cold plate assemblies and power electronics modules

Cooling devices, power modules, and vehicles incorporating the same

Jet impingement heat exchanger apparatuses and power electronics modules

Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same

Cooling member for heat containing device

Metamaterial magnetic field guide

Three dimensional magnetic field manipulation in electromagnetic devices

Magnetic fluid cooling devices and power electronics assemblies

Cooling apparatuses, electronic device assemblies, and cooling assemblies using magnetic shape memory members

Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems

TOYOTA MOTOR ENG & MFG NORTH AMERICA INC

Modular jet impingement assemblies with passive and active flow control for electronics cooling

Modular jet impingement cooling apparatuses with exchangeable jet plates

Integrated waste heat recovery and motor assisted turbocharger system

Self-powered active grille shutter system

Methods for orienting material physical properties using constraint transformation and isoparametric shape functions

ROBERT BRIAN JOSEPH

Three-dimensional power electronics packages