P

Inventor

SUGARMAN MICHAEL N

US15 patents

Patents

15 patents
US6081414AJun 27, 2000

Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system

APPLIED MATERIALS INC333 citations98
US5656093AAug 12, 1997

Wafer spacing mask for a substrate support chuck and method of fabricating same

APPLIED MATERIALS INC849 citations98
US6582578B1Jun 24, 2003

Method and associated apparatus for tilting a substrate upon entry for metal deposition

APPLIED MATERIALS INC80 citations97
US6469283B1Oct 22, 2002

Method and apparatus for reducing thermal gradients within a substrate support

APPLIED MATERIALS INC112 citations95
US6219219B1Apr 17, 2001

Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system

APPLIED MATERIALS INC63 citations93
US5356486AOct 18, 1994

Combined wafer support and temperature monitoring device

APPLIED MATERIALS INC46 citations93
US6551488B1Apr 22, 2003

Segmenting of processing system into wet and dry areas

APPLIED MATERIALS INC37 citations92
US6406359B1Jun 18, 2002

Apparatus for transferring semiconductor substrates using an input module

APPLIED MATERIALS INC28 citations92
US7513062B2Apr 7, 2009

Single wafer dryer and drying methods

APPLIED MATERIALS INC23 citations91
US7229504B2Jun 12, 2007

Methods and apparatus for determining scrubber brush pressure

APPLIED MATERIALS INC25 citations91
US6986185B2Jan 17, 2006

Methods and apparatus for determining scrubber brush pressure

APPLIED MATERIALS INC25 citations91
US7507296B2Mar 24, 2009

Methods and apparatus for determining scrubber brush pressure

APPLIED MATERIALS INC12 citations83
US5567909AOct 22, 1996

Method for supporting a wafer in a combined wafer support and temperature monitoring device

APPLIED MATERIALS INC17 citations79
US5129994AJul 14, 1992

Method and apparatus to inhibit obstruction of optical transmission through semiconductor etch process chamber viewport

APPLIED MATERIALS INC21 citations78
US6291777B1Sep 18, 2001

Conductive feed-through for creating a surface electrode connection within a dielectric body and method of fabricating same

APPLIED MATERIALS INC11 citations74