Inventor
ZENG KEJUN
US7 patents
Patents
7 patentsUS7939939B1May 10, 2011
Stable gold bump solder connections
TEXAS INSTRUMENTS INC36 citations86
US7005745B2Feb 28, 2006
Method and structure to reduce risk of gold embrittlement in solder joints
TEXAS INSTRUMENTS INC5 citations70
US6867503B2Mar 15, 2005
Controlling interdiffusion rates in metal interconnection structures
TEXAS INSTRUMENTS INC7 citations70
US7267861B2Sep 11, 2007
Solder joints for copper metallization having reduced interfacial voids
TEXAS INSTRUMENTS INC3 citations61
US9646950B2May 9, 2017
Corrosion-resistant copper bonds to aluminum
TEXAS INSTRUMENTS INC0 citations49
US7291549B2Nov 6, 2007
Method and structure to reduce risk of gold embrittlement in solder joints
TEXAS INSTRUMENTS INC0 citations49
US7070088B2Jul 4, 2006
Method of semiconductor device assembly including fatigue-resistant ternary solder alloy
TEXAS INSTRUMENTS INC1 citations49