Inventor · disambiguated record
Alexander Heilmaier
Also filed as: HEILMAIER ALEXANDER
6 granted patents·2 pending applications·36 citations·filing 2002–2019
79Inventor score
Top patents by PatentIndex Score
8 records- 0176US6861360B2Double-sided polishing process for producing a multiplicity of silicon semiconductor wafersSILTRONIC AG·Filed 2002·Granted Mar 1, 2005·20 cites·21 claims
- 0273US7108583B1Method for removing material from a semiconductor waferSILTRONIC AG·Filed 2006·Granted Sep 19, 2006·6 cites·20 claims
- 0371US9221149B2Method for polishing semiconductor wafers by means of simultaneous double-side polishingSILTRONIC AG·Filed 2014·Granted Dec 29, 2015·3 cites·20 claims
- 0468US7766724B2Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafersSILTRONIC AG·Filed 2007·Granted Aug 3, 2010·5 cites·15 claims
- 0558US8242020B2Method for producing a semiconductor waferROETTGER KLAUS·Filed 2009·Granted Aug 14, 2012·2 cites·7 claims
- 0643US2022080549A1Method for polishing a semiconductior waferSILTRONIC AG·Filed 2019·Application pending·0 cites
- 0739US2014141613A1Process for polishing a semiconductor wafer, comprising the simultaneous polishing of a front side and of a reverse side of a substrate waferSILTRONIC AG·Filed 2013·Application pending·0 cites
- 0838US10189142B2Method for polishing a semiconductor waferSILTRONIC AG·Filed 2013·Granted Jan 29, 2019·0 cites·19 claims
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