Inventor
ISHII MASAFUMI
JP3 patents
Patents
3 patentsUS9955583B2Apr 24, 2018
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
JX NIPPON MINING & METALS CORP10 citations77
US10178775B2Jan 8, 2019
Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
JX NIPPON MINING & METALS CORP1 citations58
US10519558B2Dec 31, 2019
Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus
JX NIPPON MINING & METALS CORP0 citations46