P

Inventor

OOKURA YASUSHI

JP10 patents
⚠️ This page may combine multiple inventors who share the name “OOKURA YASUSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DENSO CORP

6 patents
US7145254B2Dec 5, 2006

Transfer-molded power device and method for manufacturing transfer-molded power device

DENSO CORP45 citations92
US9691713B2Jun 27, 2017

Semiconductor device

DENSO CORP2 citations70
US9502327B2Nov 22, 2016

Semiconductor device and method for manufacturing the same

DENSO CORP2 citations57
US10002807B2Jun 19, 2018

Semiconductor device

DENSO CORP1 citations50
US12482714B2Nov 25, 2025

Semiconductor device, semiconductor module, and method for manufacturing semiconductor device

DENSO CORP0 citations49
US12476163B2Nov 18, 2025

Semiconductor device and semiconductor module

DENSO CORP0 citations46

KOYAMA MASAKI

2 patents
US8952449B2Feb 10, 2015

Semiconductor device having both IGBT area and diode area

KOYAMA MASAKI8 citations83
US8716746B2May 6, 2014

Semiconductor device

KOYAMA MASAKI11 citations83

NISHIHATA MASAYOSHI

1 patent
US8405194B2Mar 26, 2013

Semiconductor device including two heat sinks and method of manufacturing the same

NISHIHATA MASAYOSHI3 citations57

FUKUTANI KEITA

1 patent
US8497572B2Jul 30, 2013

Semiconductor module and method of manufacturing the same

FUKUTANI KEITA3 citations56