Inventor
KRISHNAN JAGEN
MY5 patents
Patents
5 patentsUS9852918B2Dec 26, 2017
Embedding additive particles in encapsulant of electronic device
INFINEON TECHNOLOGIES AG2 citations66
US10651109B2May 12, 2020
Selective plating of semiconductor package leads
INFINEON TECHNOLOGIES AG2 citations65
US10096508B2Oct 9, 2018
Assembly for handling a semiconductor die and method of handling a semiconductor die
INFINEON TECHNOLOGIES AG2 citations58
US10457001B2Oct 29, 2019
Method for forming a matrix composite layer and workpiece with a matrix composite layer
INFINEON TECHNOLOGIES AG0 citations47
US9540539B2Jan 10, 2017
Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device
INFINEON TECHNOLOGIES AG0 citations34