Inventor
NARAYANASAMY JAYAGANASAN
MY8 patents
⚠️ This page may combine multiple inventors who share the name “NARAYANASAMY JAYAGANASAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
7 patentsUS10651109B2May 12, 2020
Selective plating of semiconductor package leads
INFINEON TECHNOLOGIES AG2 citations65
US11984392B2May 14, 2024
Semiconductor package having a chip carrier with a pad offset feature
INFINEON TECHNOLOGIES AG0 citations60
US11274984B2Mar 15, 2022
Pressure sensor having a lidless/laminate structure
INFINEON TECHNOLOGIES AG0 citations58
US12334414B2Jun 17, 2025
Power semiconductor device with dual heat dissipation structures
INFINEON TECHNOLOGIES AG0 citations56
US11908771B2Feb 20, 2024
Power semiconductor device with dual heat dissipation structures
INFINEON TECHNOLOGIES AG1 citations56
US11362023B2Jun 14, 2022
Package lead design with grooves for improved dambar separation
INFINEON TECHNOLOGIES AG0 citations50
US10457001B2Oct 29, 2019
Method for forming a matrix composite layer and workpiece with a matrix composite layer
INFINEON TECHNOLOGIES AG0 citations47