Inventor
AHN JIN MO
KR17 patents
⚠️ This page may combine multiple inventors who share the name “AHN JIN MO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
16 patentsUS10170246B2Jan 1, 2019
Capacitor component with metallic protection pattern for improved mechanical strength and moisture proof reliability
SAMSUNG ELECTRO MECH2 citations71
US9984804B2May 29, 2018
Coil component
SAMSUNG ELECTRO MECH3 citations71
US9793051B2Oct 17, 2017
Multilayer ceramic capacitor and board having the same
SAMSUNG ELECTRO MECH6 citations71
US10614950B2Apr 7, 2020
Coil component assembly for mass production of coil components and coil components made from coil component assembly
SAMSUNG ELECTRO MECH3 citations70
US10049808B2Aug 14, 2018
Coil component assembly for mass production of coil components and coil components made from coil component assembly
SAMSUNG ELECTRO MECH3 citations70
US11139114B2Oct 5, 2021
Multilayer capacitor
SAMSUNG ELECTRO MECH1 citations60
US9490061B2Nov 8, 2016
Coil component and board having the same
SAMSUNG ELECTRO MECH2 citations60
US10902990B2Jan 26, 2021
Coil component and method for manufacturing same
SAMSUNG ELECTRO MECH0 citations58
US9773604B2Sep 26, 2017
Power inductor and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations52
US12217914B2Feb 4, 2025
Ceramic electronic component with openings in electrode
SAMSUNG ELECTRO MECH0 citations51
US12136518B2Nov 5, 2024
Multilayer electronic component including cover layer having insulating and conductive portions
SAMSUNG ELECTRO MECH0 citations51
US11735367B2Aug 22, 2023
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations50
US12308173B2May 20, 2025
Ceramic electronic component including insulating layer
SAMSUNG ELECTRO MECH0 citations49
US11742145B2Aug 29, 2023
Multilayer electronic component and board for mounting the same
SAMSUNG ELECTRO MECH0 citations49
US10734161B2Aug 4, 2020
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations41
US9928952B2Mar 27, 2018
Coil-embedded integrated circuit substrate and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations40