Inventor
KIM JAECHOON
KR9 patents
Patents
9 patentsUS8988115B2Mar 24, 2015
Electronic device and method for controlling temperature thereof
SAMSUNG ELECTRONICS CO LTD10 citations77
US12009303B2Jun 11, 2024
Integrated circuit semiconductor device
SAMSUNG ELECTRONICS CO LTD5 citations68
US12506047B2Dec 23, 2025
Semiconductor package and cooling system
SAMSUNG ELECTRONICS CO LTD0 citations59
US12388048B2Aug 12, 2025
Semiconductor package comprising heat spreader
SAMSUNG ELECTRONICS CO LTD0 citations59
US12237268B2Feb 25, 2025
Integrated circuit semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations56
US12243803B2Mar 4, 2025
Thermal interface material, method of manufacturing the same, and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US11935812B2Mar 19, 2024
Thermal interface material and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US12199002B2Jan 14, 2025
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12431403B2Sep 30, 2025
Semiconductor package including thermal interface material (TIM) layers on semiconductor chips
SAMSUNG ELECTRONICS CO LTD0 citations48