Inventor
CHANG CHIA-WEI
TW148 patents
⚠️ This page may combine multiple inventors who share the name “CHANG CHIA-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GETAC TECHNOLOGY CORP
12 patentsUS10201221B1Feb 12, 2019
Hand strap
GETAC TECHNOLOGY CORP25 citations94
USD830367SOct 9, 2018
Hand strap
GETAC TECHNOLOGY CORP29 citations94
USD826931SAug 28, 2018
Portable electronic device
GETAC TECHNOLOGY CORP28 citations94
USD818466SMay 22, 2018
Portable electronic device
GETAC TECHNOLOGY CORP38 citations94
USD817951SMay 15, 2018
Mobile computer
GETAC TECHNOLOGY CORP24 citations94
USD797669SSep 19, 2017
Charging dock for mobile computer
GETAC TECHNOLOGY CORP33 citations94
USD875100SFeb 11, 2020
Crashproof corner for portable computer
GETAC TECHNOLOGY CORP9 citations84
USD830226SOct 9, 2018
Buckle
GETAC TECHNOLOGY CORP9 citations84
USD826236SAug 21, 2018
Hand strap
GETAC TECHNOLOGY CORP7 citations84
USD759014SJun 14, 2016
Video display
GETAC TECHNOLOGY CORP11 citations84
US9930795B2Mar 27, 2018
Electronic device having a removable handle
GETAC TECHNOLOGY CORP13 citations79
USD791316SJul 4, 2017
Handle for endoscopic surgical clip applier
GETAC TECHNOLOGY CORP5 citations73
POWERTECH TECHNOLOGY INC
6 patentsUS9716080B1Jul 25, 2017
Thin fan-out multi-chip stacked package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC37 citations93
US10128211B2Nov 13, 2018
Thin fan-out multi-chip stacked package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC14 citations83
US9761568B2Sep 12, 2017
Thin fan-out multi-chip stacked packages and the method for manufacturing the same
POWERTECH TECHNOLOGY INC12 citations83
US9899307B2Feb 20, 2018
Fan-out chip package with dummy pattern and its fabricating method
POWERTECH TECHNOLOGY INC4 citations72
US9716079B2Jul 25, 2017
Multi-chip package having encapsulation body to replace substrate core
POWERTECH TECHNOLOGY INC2 citations72
US9659911B1May 23, 2017
Package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC3 citations72
PHOENIX PREC TECHNOLOGY CORP
6 patentsUS7507915B2Mar 24, 2009
Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same
PHOENIX PREC TECHNOLOGY CORP31 citations91
US7706148B2Apr 27, 2010
Stack structure of circuit boards embedded with semiconductor chips
PHOENIX PREC TECHNOLOGY CORP10 citations84
US7656040B2Feb 2, 2010
Stack structure of circuit board with semiconductor component embedded therein
PHOENIX PREC TECHNOLOGY CORP14 citations84
US7674986B2Mar 9, 2010
Circuit board structure having capacitor array and embedded electronic component and method for fabricating the same
PHOENIX PREC TECHNOLOGY CORP11 citations83
US7619317B2Nov 17, 2009
Carrier structure for semiconductor chip and method for manufacturing the same
PHOENIX PREC TECHNOLOGY CORP9 citations83
US7514770B2Apr 7, 2009
Stack structure of carrier board embedded with semiconductor components and method for fabricating the same
PHOENIX PREC TECHNOLOGY CORP15 citations83
EASTWEST INT TAIWAN ENTPR
3 patentsTOPWILL TRADING CO LTD
2 patentsCHANG CHIA-WEI
2 patentsSHENZHEN EPOSTAR ELECTRONICS LTD CO
2 patentsTAIWAN SEMICONDUCTOR MFG CO LTD
2 patentsBONRAYBIO CO LTD
2 patentsCHEN CHIEN-CHUAN
1 patentLIAW JHON-JHY
1 patentTAIWAN SEMICONDUCTOR MFG
1 patentGEN LIFE BIOTECHNOLOGY CO LTD
1 patentHOPUS TECHNOLOGY INC
1 patent(unassigned)
1 patentHOTECK INC
1 patentBIG HILL IND CO LTD
1 patentFARADAY TECH CORP
1 patentJANG SHENG-LYANG
1 patentWANG JIA
1 patentNIKE INC
1 patentNOVATEK MICROELECTRONICS CORP
1 patentShowing the top 50 of 148 patents by PatentIndex Score.