Inventor

CHENG JUNG WEI

TW74 patents

⚠️ This page may combine multiple inventors who share the name “CHENG JUNG WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHENG JUNG WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Stacked semiconductor devices and methods of forming same

Redistribution structures in semiconductor packages and methods of forming same

Substrate design for semiconductor packages and method of forming same

Package structures and methods of forming the same

Semiconductor package

Package-on-package structure with organic interposer

Substrate design for semiconductor packages and method of forming same

Substrate design for semiconductor packages and method of forming same

Dam for three-dimensional integrated circuit

Thermal performance structure for semiconductor packages and method of forming same

3D integrated circuit package processing with panel type lid

Concentric bump design for the alignment in die stacking

Semiconductor package including a substrate with a stepped sidewall structure

Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof

Package structure comprising buffer layer for reducing thermal stress and method of forming the same

Semiconductor packages and methods of forming the same

Package structure comprising buffer layer for reducing thermal stress and method of forming the same

Thermal performance structure for semiconductor packages and method of forming same

Semiconductor package and manufacturing method thereof

Planarization of semiconductor packages and structures resulting therefrom

Semiconductor package and semiconductor device

Substrate design for semiconductor packages and method of forming same

Dam for three-dimensional integrated circuit

Package structure

Substrate design for semiconductor packages and method of forming same

Planarization of semiconductor packages and structures resulting therefrom

Integrated circuit packages and methods of forming same

Integrated fan-out package and method of fabricating the same

Underfill dispensing with controlled fillet profile

Integrated fan-out package and method of fabricating the same

Concentric bump design for the alignment in die stacking

Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof

Semiconductor package

Package structures and methods of forming the same

Connector formation methods and packaged semiconductor devices

Electronic component and manufacturing method thereof

Dam for three-dimensional integrated circuit

Package structure comprising buffer layer for reducing thermal stress and method of forming the same

Semiconductor package and methods of fabricating a semiconductor package

Probe card substrate, substrate structure and method of fabricating the same

Semiconductor packages and methods of forming the same

Semiconductor package having molded die and semiconductor die and manufacturing method thereof

Integrated circuit packages and methods of forming same

Package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG

Package on package structures and methods for forming the same

Methods for forming a semiconductor device package

Underfill dispensing with controlled fillet profile

CHENG JUNG WEI

Package on package structures and methods for forming the same

Mold chase design for package-on-package applications

WANG TSUNG-DING

Semiconductor package having a recess filled with a molding compound