Inventor

PAN HSIN-YU

TW78 patents

⚠️ This page may combine multiple inventors who share the name “PAN HSIN-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PAN HSIN-YU

TAIWAN SEMICONDUCTOR MFG CO LTD

Packaging of semiconductor device with antenna and heat spreader

Lid design for heat dissipation enhancement of die package

Semicondcutor package and method of manufacturing the same

Integrated circuit package and method

Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device

Package structure

Package structure and manufacturing method thereof

Package structure

Semiconductor device, package structure and method of fabricating the same

Dam for three-dimensional integrated circuit

Semiconductor structure and manufacturing method thereof

3D integrated circuit package processing with panel type lid

Package structure

Package structure and manufacturing method thereof

Semiconductor device including a semiconductor die and a plurality of antenna patterns

Package structure

Semiconductor package and method of manufacturing the same

Semiconductor packages and methods of forming the same

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and method of manufacturing the same

Semiconductor package and manufacturing method thereof

Conductive traces in semiconductor devices and methods of forming same

Semiconductor device and manufacturing method thereof

Dam for three-dimensional integrated circuit

Semiconductor package and method of manufacturing the same

Semiconductor packages having thermal through vias (TTV)

Semiconductor package including thermal relaxation block and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Seal rings structures in semiconductor device interconnect layers and methods of forming the same

Conductive traces in semiconductor devices and methods of forming same

Integrated circuit package and method

Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof

Semiconductor package

Package structure and method of forming the same

Dam for three-dimensional integrated circuit

Conductive traces in semiconductor devices and methods of forming same

Semiconductor packages and methods of forming the same

Conductive traces in semiconductor devices and methods of forming same

Integrated circuit package and method

Semiconductor package and method of manufacturing the same

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG

Stacked structures and methods of fabricating stacked structures

Heat stud for stacked chip package

Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)

Semiconductor packages and methods of manufacturing thereof

Structural design for flip-chip assembly

LIU YU-WEN

Reinforcement structure for flip-chip packaging

AU OPTRONICS CORP

Substrate with touch function and display using the same

NIKO SEMICONDUCTOR CO LTD

Synchronous rectifier control device and forward synchronous rectifier circuit