Inventor
ASAI TSUTOMU
JP11 patents
⚠️ This page may combine multiple inventors who share the name “ASAI TSUTOMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUI MINING & SMELTING CO
7 patentsUS6240636B1Jun 5, 2001
Method for producing vias in the manufacture of printed circuit boards
MITSUI MINING & SMELTING CO91 citations97
US6652962B1Nov 25, 2003
Resin-coated composite foil, production and use thereof
MITSUI MINING & SMELTING CO26 citations92
US5958209ASep 28, 1999
High tensile strength electrodeposited copper foil and process of electrodepositing thereof
MITSUI MINING & SMELTING CO33 citations92
US6187416B1Feb 13, 2001
Resin composition for copper-clad laminate, resin-coated copper foil, multilayered copper-clad laminate, and multilayered printed circuit board
MITSUI MINING & SMELTING CO36 citations88
US6716530B2Apr 6, 2004
Resin compound for fabricating interlayer dielectric of printed wiring board, resin sheet and resin applied-copper foil for forming insulation layer using the resin compound, and copper-clad laminate using them
MITSUI MINING & SMELTING CO7 citations73
US6194056B1Feb 27, 2001
High tensile strength electrodeposited copper foil
MITSUI MINING & SMELTING CO13 citations73
US6831129B2Dec 14, 2004
Resin-coated copper foil, and printed wiring board using resin-coated copper foil
MITSUI MINING & SMELTING CO3 citations62