Inventor
HARA YASUJI
JP8 patents
⚠️ This page may combine multiple inventors who share the name “HARA YASUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUI MINING & SMELTING CO
5 patentsUS6984456B2Jan 10, 2006
Flexible printed wiring board for chip-on flexibles
MITSUI MINING & SMELTING CO24 citations92
US5958209ASep 28, 1999
High tensile strength electrodeposited copper foil and process of electrodepositing thereof
MITSUI MINING & SMELTING CO33 citations92
US6194056B1Feb 27, 2001
High tensile strength electrodeposited copper foil
MITSUI MINING & SMELTING CO13 citations73
US6444112B1Sep 3, 2002
Manufacturing method of electrodeposited copper foil
MITSUI MINING & SMELTING CO9 citations68
US6652725B2Nov 25, 2003
Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus
MITSUI MINING & SMELTING CO4 citations61
MITSUI MINING & SMELTING CO LTD
3 patentsUS12344953B2Jul 1, 2025
Electrolytic copper foil
MITSUI MINING & SMELTING CO LTD0 citations62
US12168838B2Dec 17, 2024
Electrolytic copper foil
MITSUI MINING & SMELTING CO LTD0 citations62
US12457686B2Oct 28, 2025
Roughened copper foil, copper-cladded laminate board, and printed wiring board
MITSUI MINING & SMELTING CO LTD0 citations57