Inventor · disambiguated record
Wei-Chun Kung
Also filed as: KUNG WEI-CHUN
3 granted patents·244 citations·filing 1999–2003
77Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG3
Top patents by PatentIndex Score
3 records- 0193US6262490B1Substrate strip for use in packaging semiconductor chipsADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jul 17, 2001·154 cites·7 claims
- 0285US7005327B2Process and structure for semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 28, 2006·79 cites·9 claims
- 0363US6482675B2Substrate strip for use in packaging semiconductor chips and method for making the substrate stripADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Nov 19, 2002·11 cites·11 claims
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