Inventor

KONDO KOUJI

JP5 patents

⚠️ This page may combine multiple inventors who share the name “KONDO KOUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DENSO CORP

2 patents

US7107661B2Sep 19, 2006

Method of recycling printed circuit board

DENSO CORP12 citations81

US7733665B2Jun 8, 2010

Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same

DENSO CORP0 citations40

MITSUBISHI PLASTICS INC

1 patent

US6228467B1May 8, 2001

Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate

MITSUBISHI PLASTICS INC59 citations93

HARADA TOSHIKAZU

1 patent

US8143529B2Mar 27, 2012

Laminated multi-layer circuit board

HARADA TOSHIKAZU8 citations79

NIFCO INC

1 patent

US11454054B2Sep 27, 2022

Lock device

NIFCO INC6 citations71