Inventor
PARK YONG-JIN
KR33 patents
⚠️ This page may combine multiple inventors who share the name “PARK YONG-JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
9 patentsUS5914626AJun 22, 1999
Voltage clamping circuit for semiconductor devices
SAMSUNG ELECTRONICS CO LTD30 citations91
US6845407B1Jan 18, 2005
Semiconductor memory device having externally controllable data input and output mode
SAMSUNG ELECTRONICS CO LTD13 citations83
US11075193B2Jul 27, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US7139847B2Nov 21, 2006
Semiconductor memory device having externally controllable data input and output mode
SAMSUNG ELECTRONICS CO LTD2 citations62
US11048364B2Jun 29, 2021
Capacitive touch panel and method for acquiring capacitance values
SAMSUNG ELECTRONICS CO LTD0 citations58
US7324456B2Jan 29, 2008
Apparatus and method for testing an xDSL transceiver unit-central office
SAMSUNG ELECTRONICS CO LTD1 citations52
US10692933B2Jun 23, 2020
Variable resistance memory device
SAMSUNG ELECTRONICS CO LTD0 citations48
US10818604B2Oct 27, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations42
US10825775B2Nov 3, 2020
Semiconductor package integrating active and passive components with electromagnetic shielding
SAMSUNG ELECTRONICS CO LTD0 citations41
HYUNDAI MOTOR CO LTD
5 patentsUSD892696SAug 11, 2020
Front door panel for an automobile
HYUNDAI MOTOR CO LTD19 citations94
USD786763SMay 16, 2017
Rear door panel for automobiles
HYUNDAI MOTOR CO LTD8 citations84
USD971809SDec 6, 2022
Front door panel for an automobile
HYUNDAI MOTOR CO LTD3 citations73
USD971808SDec 6, 2022
Rear door panel for an automobile
HYUNDAI MOTOR CO LTD3 citations73
USD892697SAug 11, 2020
Rear door panel for an automobile
HYUNDAI MOTOR CO LTD4 citations73
SAMSUNG ELECTRO MECH
3 patentsUS11769622B2Sep 26, 2023
Inductor device and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations61
US11462498B2Oct 4, 2022
Semiconductor package including frame in which semiconductor chip is embedded
SAMSUNG ELECTRO MECH0 citations52
US10283426B2May 7, 2019
Fan-out semiconductor package and photosensitive resin composition
SAMSUNG ELECTRO MECH0 citations51
SP TECH CO LTD
3 patentsUS11796355B2Oct 24, 2023
Device for fixing measuring instrument for inspecting display
SP TECH CO LTD0 citations60
US11468807B2Oct 11, 2022
RGB simultaneous correction-type device for display gamma correction
SP TECH CO LTD0 citations60
US11713614B2Aug 1, 2023
Condensation prevention type transmission window for CMS module test chamber
SP TECH CO LTD0 citations50