Inventor
KAO CHUNG-EN
TW27 patents
⚠️ This page may combine multiple inventors who share the name “KAO CHUNG-EN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
12 patentsUS10190209B2Jan 29, 2019
PVD apparatus and method with deposition chamber having multiple targets and magnets
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US12226807B2Feb 18, 2025
Cleaning device for cleaning electroplating substrate holder
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11433440B2Sep 6, 2022
Cleaning device for cleaning electroplating substrate holder
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11230791B2Jan 25, 2022
Magnetic structure for metal plating control
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10121698B2Nov 6, 2018
Method of manufacturing a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US11111910B2Sep 7, 2021
Ultra high vacuum cryogenic pumping apparatus with nanostructure material
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations56
US9548241B2Jan 17, 2017
Semiconductor device metallization systems and methods
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10526719B2Jan 7, 2020
Magnetic structure for metal plating control
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10307798B2Jun 4, 2019
Cleaning device for cleaning electroplating substrate holder
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9865478B2Jan 9, 2018
Shielding design for metal gap fill
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9574265B2Feb 21, 2017
Rotation plus vibration magnet for magnetron sputtering apparatus
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US10145371B2Dec 4, 2018
Ultra high vacuum cryogenic pumping apparatus with nanostructure material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations46
TAIWAN SEMICONDUCTOR MFG
6 patentsUS6743296B2Jun 1, 2004
Apparatus and method for self-centering a wafer in a sputter chamber
TAIWAN SEMICONDUCTOR MFG21 citations92
US9318364B2Apr 19, 2016
Semiconductor device metallization systems and methods
TAIWAN SEMICONDUCTOR MFG3 citations73
US6652716B2Nov 25, 2003
Apparatus and method for self-aligning a cover ring in a sputter chamber
TAIWAN SEMICONDUCTOR MFG10 citations66
US9281221B2Mar 8, 2016
Ultra-high vacuum (UHV) wafer processing
TAIWAN SEMICONDUCTOR MFG1 citations47
US6660125B2Dec 9, 2003
Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
TAIWAN SEMICONDUCTOR MFG0 citations46
US6358851B1Mar 19, 2002
Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
TAIWAN SEMICONDUCTOR MFG1 citations46