Inventor
WATANABE FUMITOMO
JP17 patents
⚠️ This page may combine multiple inventors who share the name “WATANABE FUMITOMO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
9 patentsUS10217719B2Feb 26, 2019
Semiconductor device assemblies with molded support substrates
MICRON TECHNOLOGY INC28 citations94
US10998290B2May 4, 2021
Semiconductor device assemblies with molded support substrates
MICRON TECHNOLOGY INC5 citations84
US10453762B2Oct 22, 2019
Shielded fan-out packaged semiconductor device and method of manufacturing
MICRON TECHNOLOGY INC3 citations71
US12119325B2Oct 15, 2024
Semiconductor device assemblies with molded support substrates
MICRON TECHNOLOGY INC0 citations62
US11742252B2Aug 29, 2023
Shielded fan-out packaged semiconductor device and method of manufacturing
MICRON TECHNOLOGY INC0 citations61
US11335667B2May 17, 2022
Stacked semiconductor die assemblies with die substrate extensions
MICRON TECHNOLOGY INC0 citations61
US11158554B2Oct 26, 2021
Shielded fan-out packaged semiconductor device and method of manufacturing
MICRON TECHNOLOGY INC0 citations61
US10147705B2Dec 4, 2018
Stacked semiconductor die assemblies with die substrate extensions
MICRON TECHNOLOGY INC1 citations61
US10553566B2Feb 4, 2020
Stacked semiconductor die assemblies with die substrate extensions
MICRON TECHNOLOGY INC0 citations51
ELPIDA MEMORY INC
4 patentsUS8786102B2Jul 22, 2014
Semiconductor device and method of manufacturing the same
ELPIDA MEMORY INC16 citations84
US7888179B2Feb 15, 2011
Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof
ELPIDA MEMORY INC12 citations83
US7928551B2Apr 19, 2011
Semiconductor device and method of manufacturing the same
ELPIDA MEMORY INC13 citations78
US7993975B2Aug 9, 2011
Method of manufacturing semiconductor device including mounting and dicing chips
ELPIDA MEMORY INC2 citations62
KAGAYA YUTAKA
2 patentsUS8076770B2Dec 13, 2011
Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion
KAGAYA YUTAKA72 citations94
US8710647B2Apr 29, 2014
Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board
KAGAYA YUTAKA0 citations49