Inventor

ZIGLIOLI FEDERICO GIOVANNI

IT61 patents

⚠️ This page may combine multiple inventors who share the name “ZIGLIOLI FEDERICO GIOVANNI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZIGLIOLI FEDERICO GIOVANNI

ST MICROELECTRONICS SRL

Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device

Package, in particular for MEMS devices and method of making same

Pressure sensing device with cavity and related methods

Tensile stress measurement device with attachment plates and related methods

Ink printed wire bonding

Package, made of building material, for a parameter monitoring device, within a solid structure, and relative device

Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof

Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a MEMS microphone and packaged device obtained thereby

Integrated electronic device for monitoring mechanical stress within a solid structure

Packaged device exposed to environmental air and liquids and manufacturing method thereof

Method of manufacturing semiconductor devices with a paddle and electrically conductive clip and corresponding semiconductor device

Method of manufacturing semiconductor devices with a paddle and electrically conductive clip connected to a leadframe and corresponding semiconductor device

Semiconductor package with wettable flank

Semiconductor device, corresponding circuit and method

Method of manufacturing semiconductor devices and corresponding product

Method of manufacturing semiconductor devices

Pressure sensing device with cavity and related methods

IC with insulating trench and related methods

Electronic components with integral lead frame and wires

Tensile stress measurement device with attachment plates and related methods

Stacked assembly of a MEMS integrated device having a reduced thickness

Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device

Pressure sensing device with cavity and related methods

Semiconductor structure with low-melting-temperature conductive regions, and method of repairing a semiconductor structure

Wafer-level packaging of a MEMS integrated device and related manufacturing process

Planar electric board with pliable wings and system for sensing components along three coordinate axis of inner forces in a block made of a building material

Package, in particular for MEMS devices and method of making same

Semiconductor package with wettable flank

Method of manufacturing semiconductor devices and corresponding semiconductor device

IC with insulating trench and related methods

ASICS face to face self assembly

Assembly of an integrated device enabling a facilitated fluidic connection to regions of the device

Method of manufacturing semiconductor devices, corresponding device and circuit

Method of manufacturing semiconductor devices, corresponding device and circuit

Method of manufacturing quad flat no-lead semiconductor devices and corresponding quad flat no-lead semiconductor device

Method of manufacturing semiconductor devices and corresponding semiconductor device

Method of manufacturing semiconductor devices and corresponding semiconductor device

Method of manufacturing semiconductor devices, corresponding device and circuit

Method of manufacturing semiconductor devices and corresponding semiconductor device

Electronic components with integral lead frame and wires

Semiconductor package with electrical test pads

Methods, circuits and systems for a package structure having wireless lateral connections

Ink printed wire bonding

Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof

ZIGLIOLI FEDERICO GIOVANNI

Integrated chemical sensor for detecting odorous matters

Electronic MEMS device comprising a chip bonded to a substrate and having cavities and manufacturing process thereof

Fluidic cartridge for detecting chemicals in samples, in particular for performing biochemical analyses

Manufacturing method of an electronic device including overmolded MEMS devices

ZHANG XUEREN

Piezo-resistive force sensor with bumps on membrane structure

STMICROELETRONICS S R L

Integrated electronic device for detecting a local parameter related to a force experienced in a predetermined direction, within a solid structure