Inventor
REINMUTH JOCHEN
DE117 patents
⚠️ This page may combine multiple inventors who share the name “REINMUTH JOCHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BOSCH GMBH ROBERT
37 patentsUS9709451B2Jul 18, 2017
Micromechanical pressure sensor device and corresponding manufacturing method
BOSCH GMBH ROBERT7 citations84
US9227837B2Jan 5, 2016
Sensor and method for manufacturing a sensor
BOSCH GMBH ROBERT15 citations84
US10094725B2Oct 9, 2018
Production method for a detection apparatus and detection apparatuses
BOSCH GMBH ROBERT13 citations82
US10845262B2Nov 24, 2020
Micromechanical component for a pressure sensor device
BOSCH GMBH ROBERT2 citations73
US9958348B2May 1, 2018
Micromechanical pressure sensor device and corresponding manufacturing method
BOSCH GMBH ROBERT3 citations73
US9409764B2Aug 9, 2016
Microelectromechanical component and manufacturing method for microelectromechanical components
BOSCH GMBH ROBERT3 citations73
US10011479B2Jul 3, 2018
MEMS structural component including a deflectable diaphragm and a fixed counter-element as well as a method for manufacturing it
BOSCH GMBH ROBERT3 citations72
US9725309B2Aug 8, 2017
Micromechanical sensor device and corresponding manufacturing method
BOSCH GMBH ROBERT2 citations72
US10556789B2Feb 11, 2020
Laser resealing with stress-reducing prestructuring
BOSCH GMBH ROBERT2 citations71
US10029911B2Jul 24, 2018
Micromechanical component including a diffusion stop channel
BOSCH GMBH ROBERT4 citations71
US9919919B2Mar 20, 2018
Laser reseal including an additional layer and alloy formation
BOSCH GMBH ROBERT5 citations71
US9890035B2Feb 13, 2018
Method for manufacturing a micromechanical component
BOSCH GMBH ROBERT4 citations71
US10207366B2Feb 19, 2019
Laser reseal including optimized intensity distribution
BOSCH GMBH ROBERT2 citations70
US9567212B2Feb 14, 2017
Micromechanical component
BOSCH GMBH ROBERT2 citations70
US10017375B2Jul 10, 2018
Structures for reducing and preventing stress and tensions during processing of silicon with the aid of melting by a laser
BOSCH GMBH ROBERT2 citations69
US10017380B1Jul 10, 2018
Combined laser drilling and the plasma etch method for the production of a micromechanical device and a micromechanical device
BOSCH GMBH ROBERT5 citations67
US11976995B2May 7, 2024
Micromechanical component for a capacitive sensor or switch device
BOSCH GMBH ROBERT1 citations63
US11846509B2Dec 19, 2023
Three-axis rotation rate sensor including a substrate and a double rotor
BOSCH GMBH ROBERT1 citations63
US11585710B2Feb 21, 2023
Capacitive pressure sensor with reduced bimetal effect
BOSCH GMBH ROBERT0 citations63
US11125771B2Sep 21, 2021
Micromechanical z-inertial sensor
BOSCH GMBH ROBERT0 citations63
US10807860B2Oct 20, 2020
Micromechanical component for a pressure sensor device
BOSCH GMBH ROBERT1 citations63
US9422152B2Aug 23, 2016
Hybridly integrated module having a sealing structure
BOSCH GMBH ROBERT2 citations63
US8347721B2Jan 8, 2013
Acceleration sensor
BOSCH GMBH ROBERT4 citations63
US12230458B2Feb 18, 2025
MEMS relay
BOSCH GMBH ROBERT0 citations62
US12181356B2Dec 31, 2024
Micromechanical component for a pressure and inertial sensor device
BOSCH GMBH ROBERT1 citations62
US12027336B2Jul 2, 2024
Capacitively operable MEMS switch
BOSCH GMBH ROBERT1 citations62
US11978658B2May 7, 2024
Method for manufacturing a polysilicon SOI substrate including a cavity
BOSCH GMBH ROBERT0 citations62
US11912563B2Feb 27, 2024
Micromechanical component and method for manufacturing a micromechanical component
BOSCH GMBH ROBERT1 citations62
US10913652B2Feb 9, 2021
Micromechanical z-inertial sensor
BOSCH GMBH ROBERT0 citations61
US11897756B2Feb 13, 2024
Micromechanical device with contact pad
BOSCH GMBH ROBERT0 citations60
US11214482B2Jan 4, 2022
Micromechanical device including a covering bond frame
BOSCH GMBH ROBERT0 citations60
US10836631B2Nov 17, 2020
Method for closing off a micromechanical device by laser melting, and micromechanical device having a laser melt closure
BOSCH GMBH ROBERT1 citations60
US11897758B2Feb 13, 2024
Electrical contacting and method for producing an electrical contacting
BOSCH GMBH ROBERT0 citations58
US12448281B2Oct 21, 2025
Micromechanical sensor structure with damping structure
BOSCH GMBH ROBERT0 citations57
US11874291B2Jan 16, 2024
Method for temperature compensation of a microelectromechanical sensor, and microelectromechanical sensor
BOSCH GMBH ROBERT1 citations57
US11261082B2Mar 1, 2022
Micromechanical device and method for manufacturing a micromechanical device
BOSCH GMBH ROBERT0 citations56
US10899603B2Jan 26, 2021
Micromechanical z-inertial sensor
BOSCH GMBH ROBERT0 citations56
REINMUTH JOCHEN
10 patentsUS8671757B2Mar 18, 2014
Micromechanical component
REINMUTH JOCHEN10 citations84
US9035432B2May 19, 2015
Component having through-hole plating, and method for its production
REINMUTH JOCHEN5 citations71
US8778194B2Jul 15, 2014
Component having a through-connection
REINMUTH JOCHEN5 citations71
US9038466B2May 26, 2015
Micromechanical component and manufacturing method for a micromechanical component
REINMUTH JOCHEN2 citations63
US8850891B2Oct 7, 2014
Micromechanical component and manufacturing method for a micromechanical component
REINMUTH JOCHEN2 citations63
US8756996B2Jun 24, 2014
Micromechanical system
REINMUTH JOCHEN2 citations63
US8749250B2Jun 10, 2014
Micromechanical component and manufacturing method for a micromechanical component
REINMUTH JOCHEN2 citations63
US8299549B2Oct 30, 2012
Layer structure for electrical contacting of semiconductor components
REINMUTH JOCHEN4 citations62
US8196474B2Jun 12, 2012
Pressure sensor
REINMUTH JOCHEN4 citations62
US8692339B2Apr 8, 2014
Micromechanical component having a rear volume
REINMUTH JOCHEN2 citations60
ZIMMER GMBH
1 patentCLASSEN JOHANNES
1 patentKAELBERER ARND
1 patentShowing the top 50 of 117 patents by PatentIndex Score.